图片仅供参考,产品以实物为准
类型 | Backplane |
触点数 | 437 |
端接方式 | Press Fit |
安装 | Through Hole |
触点电镀 | Gold Over Palladium Nickel |
标准包装 | Trays |
RoHSELV合规性 | RoHS compliant, ELV compliant |
性能等级 | 1 (500 mating cycles) |
Lead Free Solder Processes | Not relevant for lead free process |
屏蔽 | No |
加载行 | A, B, C, D, E (All Positions) |
品牌 | AMP |
触点区域镀层材料 | Gold over Palladium Nickel |
系统单位数 | 10 |
位置数 | 437 |
要终止 | Printed Circuit Board |
高速 | Yes |
性别 | Female |
产品类型 | Connector |
RoHSELV符合记录 | Always was RoHS compliant |
PCB安装角度 | Right Angle |
引脚类型 | Press-In |
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